Packaging Engineer - Inductor and Power module
Free account needed to apply or save. It takes a minute, and we'll bring you right back to this job.
How well do you match this job?
Key details
- Location
- Japan
- Work style
- Onsite
- Level
- Senior
- Experience
- 5–8 yrs
- Function
- Hardware, mechanical & civil engineering
- Focus area
- other
- Posted
- 1w ago
Skills
ai/mldfmjapanesesem
About the role
The Emerging Packaging Technologies at Texas Instruments is looking for a candidate for Inductor and Power module development engineer
Responsibilities:
- Design and develop ultra-compact, high-density, high current (100–300A) power delivery modules targeting enterprise and AI infrastructure applications.
- Understand market trends and end equipment system requirements and translate these into package design specifications.
- Work with magnetic material and component suppliers to evaluate and qualify materials, inductors, and capacitors that meet performance, reliability, and scaling requirements.
- Ensure manufacturability, testability, and reliability through evaluation, material qualification, and supplier collaboration.
- Collaborate with cross-functional teams across sites to support development schedules and time-to-market targets.
Minimum Qualifications:
- MS degree in Electrical Engineering, Materials Science, or related field with focus on magnetics and power packaging.
- 5+ years of hands-on experience in inductor design or package development.
- Working knowledge of power delivery architectures, thermal management, EMI, and reliability constraints.
- Good understanding of magnetic material types.
- Familiarity with material characterization techniques (BH analyzer, VSM, SEM, EDX).
- Understanding of material processing for ceramic, metal powder, and composite materials.
- Familiarity with inductor coil forming and termination processes: wire wound, multilayer, metal composite, thin film, etc.
- Good communication skills; able to work effectively with internal teams and external suppliers.
- Proficiency in English and Japanese.
Preferred Qualifications:
- Hands-on experience with simulation tools such as Maxwell, Ansys, or Femtet; familiarity with homogenization, model order reduction, and optimization techniques (NN, AI/ML a plus).
- Prior contributions to patents or publications in magnetics, packaging, or passive integration.
- Familiarity with magnetic supplier capabilities and emerging research directions.
Why TI?
- The future starts here. As a TIer, you'll play a critical role in defining the next era of semiconductor technology and help create the innovations that shape the world around us.
- Surround yourself with a team of innovators who value your unique perspective and will challenge you to bring your best self to work every day. We believe that fostering a culture of collaboration fuels both personal growth and technological breakthroughs. Explore our company culture.
- At TI, your success goes beyond your work. Take advantage of comprehensive benefits designed to support your total well-being at work and in life, from competitive compensation to extensive health coverage and wellness programs. Learn more about our benefits offerings.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.
If you are interested in this position, please apply to this requisition.